Episode
Under the Hood of Intelligent Systems
- Podcast
- EE Times Current
- Published
- Jun 27, 2026
- Duration seconds
- 1948
- Processing state
not_requested- Canonical source
- https://podcast.show/aspencore/episode/154112604/
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Summary
Some of the most critical semiconductor innovation today sits beneath intelligent systems, where data moves, connects, and scales. As architectures become more distributed, sensor-rich, and AI-driven, challenges in bandwidth, latency, power, and interoperability intensify. In this episode, we unpack the interface technologies driving this evolution: from automotive SerDes to advanced imaging and next-gen connectivity.