{"podcast":{"title":"Inside Electronics","slug":"inside-electronics-6742169","podcast_index_feed_id":6742169,"rss_url":"https://feed.podbean.com/insideelectronics/feed.xml","website_url":"https://insideelectronics.podbean.com","image_url":"https://pbcdn1.podbean.com/imglogo/image-logo/17189379/FINAL_38ht6u.jpg","author":"Endeavor Business Media","episode_count":122,"summary":"Electronic Design has been serving the engineering community with pride for decades, providing you with news, commentary, and interviews about what is going on in the industry. Now, we are expanding that footprint with our new podcast, Inside Electronics. Hosted by industry veteran Alix Paultre, the podcast will bring you commentary, news, and interviews about the things going on in the electronic design engineering community and its surrounding business ecosystem.","last_synced_at":null,"page_url":"https://stenobird.com/podcast/inside-electronics-6742169"},"episode":{"title":"How AI Is Reshaping Memory in the Data Center","slug":"how-ai-is-reshaping-memory-in-the-data-center","published_at":"2026-04-10T14:09:01+00:00","page_url":"https://stenobird.com/podcast/inside-electronics-6742169/how-ai-is-reshaping-memory-in-the-data-center","show_page_url":"https://stenobird.com/podcast/inside-electronics-6742169","url":"https://insideelectronics.podbean.com/e/how-ai-is-reshaping-memory-in-the-data-center/","audio_url":"https://mcdn.podbean.com/mf/web/mtyzbqd669yxg6xg/Winbond_V2_mixdown69b4v.mp3","summary":"AI and data center growth are putting unprecedented pressure on memory infrastructure, and the industry is feeling the effects. In this episode of Inside Electronics, host Alix Palture speaks with Brian Watson, Marketing Manager for Customized Memory Solutions at Winbond, about the challenges created by the rapid shift toward HBM and DDR5, the ongoing shortage of DDR4, and why legacy memory technologies remain essential for many real-world designs. Brian shares how Winbond helps customers bridge supply gaps, support long product lifecycles, and deliver performance through solutions like Cube architecture for applications that need bandwidth without the HBM price point. If you want a clear look at the memory pressures shaping AI, data centers, and the broader engineering landscape, this episode is for you.","meta_description":"AI and data center growth are putting unprecedented pressure on memory infrastructure, and the industry is feeling the effects. In this episode of Inside…","key_points":[],"chapters":[],"topics":[],"duration_seconds":728,"processing_state":"not_requested","actions":[{"name":"request_transcript","method":"POST","url":"https://stenobird.com/v1/public/podcasts/inside-electronics-6742169/episodes/how-ai-is-reshaping-memory-in-the-data-center/transcription-requests","description":"Idempotently request low-priority transcript generation for this episode."},{"name":"read_markdown","method":"GET","url":"https://stenobird.com/podcast/inside-electronics-6742169/how-ai-is-reshaping-memory-in-the-data-center.md","description":"Read the agent-friendly Markdown representation of this episode resource."}]}}