# Why Quantum Computing Needs a New Type of Chip Packaging

Page: https://stenobird.com/podcast/quantum-computing-business-with-fexingo-hardware-software-and-enterprise-quantum-7872009/why-quantum-computing-needs-a-new-type-of-chip-packaging
Text version: https://stenobird.com/podcast/quantum-computing-business-with-fexingo-hardware-software-and-enterprise-quantum-7872009/why-quantum-computing-needs-a-new-type-of-chip-packaging.md
Podcast: [Quantum Computing Business with Fexingo: Hardware, Software, and Enterprise Quantum](https://stenobird.com/podcast/quantum-computing-business-with-fexingo-hardware-software-and-enterprise-quantum-7872009)
Published: 2026-06-08T20:11:37+00:00
Episode link: https://audio.fexingo.com/business/quantum-computing-business/episode-0039.mp3
Audio file: https://audio.fexingo.com/business/quantum-computing-business/episode-0039.mp3
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Duration seconds: 757

## Resource

Episode 39 of Quantum Computing Business with Fexingo digs into the unsung bottleneck of quantum scaling: advanced chip packaging. Lucas and Luna explain why linking qubits across multiple chips is harder than building the qubits themselves, and how a startup called QP-Tech just raised $45 million to solve it with a novel cryogenic interposer. They explore the physics of thermal mismatches, the economics of modular quantum systems, and why packaging may determine who wins the race to fault-tolerance. Along the way, they touch on the surprising role of legacy semiconductor supply chains and why Intel's packaging patents could give it a dark-horse advantage. A concrete look at the infrastructure problem nobody talks about at quantum conferences. #QuantumComputing #ChipPackaging #QPTech #CryogenicInterposer #AdvancedPackaging #ModularQuantum #Semiconductors #Intel #QubitScaling #BusinessAndTechnology #FexingoBusiness #BusinessPodcast #Hardware #QuantumHardware #ThermalManagement #Investment #Startup #Scaling Keep every episode free: buymeacoffee.com/fexingo

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