# Thermal challenges in Powering AI

Page: https://stenobird.com/podcast/podcast4engineers-7195700/thermal-challenges-in-powering-ai
Text version: https://stenobird.com/podcast/podcast4engineers-7195700/thermal-challenges-in-powering-ai.md
Podcast: [Podcast4Engineers](https://stenobird.com/podcast/podcast4engineers-7195700)
Published: 2025-03-11T04:56:00+00:00
Episode link: https://podcast4engineers.podbean.eu/e/thermal-challenges-in-powering-ai/
Audio file: https://mcdn.podbean.eu/mf/web/sqxvecajt4uv2a55/wpai11_audio.mp3
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JSON: https://stenobird.com/v1/public/podcasts/podcast4engineers-7195700/episodes/thermal-challenges-in-powering-ai
Duration seconds: 1253

## Resource

In this episode of Podcast4Engineers, host Peter Balint sits down with Davide Chiola, VP of Systems Solutions at Infineon, to explore the critical role of thermal management in AI data centers. They discuss innovative cooling techniques, design challenges, and emerging trends like liquid cooling and superconductivity, shaping the future of high-performance computing. Learn more about Infineon's data center solutions here. Have a question or topic suggestion for our next episode? Email us at wepowerai@infineon.com.

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## Transcript

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