# Automated Multiphysics for 3D IC Success

Page: https://stenobird.com/podcast/ee-times-current-709434/automated-multiphysics-for-3d-ic-success
Text version: https://stenobird.com/podcast/ee-times-current-709434/automated-multiphysics-for-3d-ic-success.md
Podcast: [EE Times Current](https://stenobird.com/podcast/ee-times-current-709434)
Published: 2026-03-06T15:00:00+00:00
Episode link: https://podcast.show/aspencore/episode/152679386/
Audio file: https://media.blubrry.com/aspencore/content.blubrry.com/aspencore/Aspencore_EETC_SiemensEDA_JohnShetha_022626.mp3
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JSON: https://stenobird.com/v1/public/podcasts/ee-times-current-709434/episodes/automated-multiphysics-for-3d-ic-success
Duration seconds: 1722

## Resource

Challenges: power generates heat. Heat distorts wires and changes transistor behavior. A change in wires and transistors implies that initial power estimates were wrong. More and more designers are moving to heterogeneous architectures. This comes with new challenges as compared to the 2D domain. Come learn how the Calibre team can help achieve successful 3D IC design goals.

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## Transcript

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